Developing the Cu/Sn Multilayer Composite through Accumulative Roll Bonding (ARB): Investigating the Microstructural and Mechanical Features

Document Type : Research Paper

Authors

1 Department of Mechanical Engineering, Islamic Azad University, Shiraz Branch, Shiraz, Iran

2 Department of Materials Science and Engineering, Islamic Azad University, Shiraz Branch, Shiraz, Iran

Abstract

In this research, multilayer Cu/Sn composites were produced for the first time with the accumulative roll bonding (ARB) method using the commercial pure Cu and Sn sheets in up to eight cycles. The microstructural and mechanical properties of the Cu/Sn composites were studied during various ARB cycles by field emission scanning electron microscopy (FESEM), elemental mapsand X- ray diffraction (XRD), as well as tensile and Vickers micro-hardness tests. The results revealed that the necking and rupturing of the layers take place after 2 and 3 cycles, respectively. The final microstructure consists of the uniform distribution of the hard copper fragments and wavy soft Sn matrix. XRD and FESEM results confirmed the formation of the intermetallic Cu6Sn5 compound after 6 cycles. The maximum tensile strength reached 290 MPa after one ARB cycle, which is around 1.4 and 13 times higher than that of the pure Cu and Sn, respectively; thereafter, it decreased and then increased up to 150 MPa in the 8th cycle. The hardness of the copper layers increased by rising the number of ARB cycles. The tensile fracture mode for Cu and Sn layers was ductile in all ARB cycles. Further dimples were observed in the copper layers.

Keywords

References

 [1] Y. Saito, N. Tsuji, H. Utsunomiya, T. Sakai, R.G. Hong, Ultra-fine grained bulk aluminum produced by accumulative roll-bonding proces, Scripta Materialia, 40 (1999) 795-800.
[2] M. Delshad Gholami, R. Hashemi, M. Sedighi, M.D. Gholami, R. Hashemi, M. Sedighi, The effect of temperature on the mechanical properties and forming limit diagram of aluminum strips fabricated by accumulative roll bonding process, Journal of Materials Research and Technology, 9 (2020) 1831-1846.
[3] S.A. Hosseini, H.D. Manesh, High-strength, high-conductivity ultra-fine grains commercial pure copper produced by ARB process, Materials and Design, 30 (2009) 2911-2918.
[4] S. Ghafari-Gousheh, S. Hossein Nedjad, J. Khalil-Allafi, Tensile properties and interfacial bonding of multi-layered, high-purity titanium strips fabricated by ARB process, Journal of the Mechanical Behavior of Biomedical Materials, 51 (2015) 147-153.
[5] M. R. Toroghinejad, F. Ashrafizadeh, R. Jamaati, On the use of accumulative roll bonding process to develop nanostructured aluminum alloy 5083, Materials Science and Engineering A, 561 (2013) 145-151.
[6] S. Roy, D. Satyaveer Singh, S. Suwas, S. Kumar, K. Chattopadhyay, Microstructure and texture evolution during accumulative roll bonding of aluminium alloy AA5086, Materials Science & Engineering A, 528 (2011) 8469-8478.
[7] C. Lei, X. Deng, X. Li, Z. Wang, Simultaneous enhancement of strength and ductility through coordination deformation and multi-stage transformation induced plasticity (TRIP) effect in heterogeneous metastable austenitic steel, Scripta Materialia, 162 (2019) 421-425.
[8] X. Rao, Y. Wu, X. Pei, Y. Jing, L. Luo, Y. Liu, J. Lu, Influence of rolling temperature on microstructural evolution and mechanical behavior of AZ31 alloy with accumulative roll bonding, Materials Science and Engineering: A, 754 (2019) 112-120.
[9] X. Luo, Z. Feng, T. Yu, T. Huang, R. Li, G. Wu, N. Hansen, X. Huang, Microstructural evolution in Mg-3Gd during accumulative roll-bonding, Materials Science and Engineering A, 772 (2020) 138763.
[10] X.Y. Yang, Q.S. Mei, X.M. Mei, Y. Ma, F. Chen, L. Wan, J.Y. Li, Materials Science & Engineering A Al matrix composites reinforced by high volume fraction of TiAl 3 fabricated through combined accumulative roll-bonding processes, 754 (2019) 309-317.
[11] F. Ferreira, I. Ferreira, E. Camacho, F. Lopes, A.C. Marques, A. Velhinho, Graphene oxide-reinforced aluminium-matrix nanostructured composites fabricated by accumulative roll bonding, Composites Part B: Engineering, 164 (2019) 265-271.
[12] A. Melaibari, A. Fathy, M. Mansouri, M.A. Eltaher, Experimental and numerical investigation on strengthening mechanisms of nanostructured Al-SiC composites, Journal of Alloys and Compounds, 774 (2019) 1123-1132.
[13] S. Mansourzadeh, M. Hosseini, E. Salahinejad, A.H. Yaghtin, Cu-(B4C)p metal matrix composites processed by accumulative roll-bonding, Progress in Natural Science: Materials International, 26 (2016) 613-620.
[14] G.P.P. Zhang, Q.S.S. Mei, C.L.L. Li, F. Chen, X.M.M. Mei, J.Y.Y. Li, X.F.F. Ruan, Fabrication and properties of Al-TiAl3-Al2O3 composites with high content of reinforcing particles by accumulative roll-bonding and spark plasma sintering, Materials Today Communications, 24 (2020) 3-8.
[15] A.I. Khadir, A. Fathy, A.I. Khdair, A. Fathy, Enhanced strength and ductility of Al-SiC nanocomposites synthesized by accumulative roll bonding, Journal of Materials Research and Technology, 9 (2020) 478-489.
[16] L. Ghalandari, M.M. Mahdavian, M. Reihanian, Microstructure evolution and mechanical properties of Cu/Zn multilayer processed by accumulative roll bonding (ARB), Materials Science and Engineering A, 593 (2014) 145-152.
[17] M.M.M. Mahdavian, L. Ghalandari, M. Reihanian, Accumulative roll bonding of multilayered Cu/Zn/Al: An evaluation of microstructure and mechanical properties, Materials Science and Engineering A, 579 (2013) 99-107.
[18] L. Ghalandari, M.M.M. Mahdavian, M. Reihanian, M. Mahmoudiniya, Production of Al/Sn multilayer composite by accumulative roll bonding (ARB): A study of microstructure and mechanical properties, Materials Science and Engineering A, 661 (2016) 179-186.
[19] A. Mashhadi, A. Atrian, L. Ghalandari, Mechanical and microstructural investigation of Zn/Sn multilayered composites fabricated by accumulative roll bonding (ARB) process, Journal of Alloys and Compounds, 727 (2017) 1314-1323.
[20] L. Ghalandari, M.M. Moshksar, High-strength and high-conductive Cu/Ag multilayer produced by ARB, Journal of Alloys and Compounds, 506 (2010) 172–178.
[21] D.C.C. Magalhães, V.L. Sordi, A.M. Kliauga, Microstructure evolution of multilayered composite sheets of AA1050/AA7050 Al alloys produced by Asymmetric Accumulative Roll-Bonding, Materials Characterization, 162 (2020) 110226.
[22] L.F. Zhang, R. Gao, B.L. Zhao, M. Sun, K. Jing, X.P. Wang, T. Hao, Z.M. Xie, R. Liu, Q.F. Fang, C.S. Liu, Effects of annealing temperature and layer thickness on hardening behavior in cross accumulative roll bonded Cu/Fe nanolamellar composite, Journal of Alloys and Compounds, 827 (2020) 154312.
[23] M.M. Mahdavian, H. Khatami-Hamedani, H.R. Abedi, Macrostructure evolution and mechanical properties of accumulative roll bonded Al/Cu/Sn multilayer composite, Journal of Alloys and Compounds, 703 (2017) 605-613.
[24] M. Talebian, M. Alizadeh, Manufacturing Al/steel multilayered composite by accumulative roll bonding and the effects of subsequent annealing on the microstructural and mechanical characteristics, Materials Science and Engineering A, 590 (2014) 186-193.
[25] R.N. Dehsorkhi, F. Qods, M. Tajally, Investigation on microstructure and mechanical properties of Al-Zn composite during accumulative roll bonding (ARB) process, Materials Science and Engineering A, 530 (2011) 63-72.
[26] M. Tayyebi, B. Eghbali, Study on the microstructure and mechanical properties of multilayer Cu/Ni composite processed by accumulative roll bonding, Materials Science and Engineering A, 559 (2013) 759-764.
[27] M. Alizadeh, M. Talebian, Fabrication of Al/Cu p composite by accumulative roll bonding process and investigation of mechanical properties, Materials Science and Engineering A, 558 (2012) 331-337.
[28] C. Hai, Z. Mingyi, Effect of Intermetallic Compounds on the Fracture Behavior of Mg/Al Laminated Composite Fabricated by Accumulative Roll Bonding, Rare Metal Materials and Engineering, 45 (2016) 2242-2245.
[29] M. Alizadeh, M. Samiei, Fabrication of nanostructured Al/Cu/Mn metallic multilayer composites by accumulative roll bonding process and investigation of their mechanical properties, Materials and Design, 56 (2014) 680-684.
[30] G. Anne, M.R. Ramesh, H.S. Nayaka, S.B. Arya, Investigation of microstructure and mechanical properties of Mg–Zn/Al multilayered composite developed by accumulative roll bonding, Perspectives in Science, 8 (2016) 104-106.
[31] S. Roy, B.R. Nataraj, S. Suwas, S. Kumar, K. Chattopadhyay, Accumulative roll bonding of aluminum alloys 2219/5086 laminates: Microstructural evolution and tensile properties, Materials and Design, 36 (2012) 529-539.
[32] K. Wu, H. Chang, E. Maawad, W.M. Gan, H.G. Brokmeier, M.Y. Zheng, Microstructure and mechanical properties of the Mg/Al laminated composite fabricated by accumulative roll bonding (ARB), Materials Science and Engineering: A, 527 (2010) 3073-3078.
[33] F. Emitters, Supramolecular Chemistry of Fullerenes and Carbon Nanotubes Carbon Nanotube and Related Raman Spectroscopy in Graphene Related Systems Carbon Materials and Nanotechnology Carbon Nanomaterials Carbon Nanotubes and Related Structures.
[34] H.M. Mallikurjuna, K.T. Kashyap, P.G. Koppad, C.S.  Ramesh, R. Keshavamurty, Microstructure and dry sliding wear behavior of Cu-Sn alloy reinforced with multiwalled carbon nanotubes, Transactions of Nonferrous Metals Society of China (English Edition), 26 (2016) 1755-1764.
[35] O. Yılmaz, H. Turhan, The relationships between wear behavior and thermal conductivity of CuSn / M7 C3 – M 23 C 6 composites at ambient and elevated temperatures, Composites Science and Technology, 61 (2001) 2349-2359.
[36] Y.M. Hwang, H.H. Hsu, H.J. Lee, Analysis of plastic instability during sandwich sheet rolling, International Journal of Machine Tools and Manufacture, 36 (1996) 47-62.
[37] M. Rahdari, M. Reihanian, S.M.L. Baghal, Microstructural control and layer continuity in deformation bonding of metallic laminated composites, Materials Science and Engineering A, 738 (2018) 98-110.
[38] A.C.K. So, Y.C. Chan, J.K.L. Lai, Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 20 (1997) 161–166.
[39] Y. Shu, S. Gheybi, T. Ando, Z. Gu, Ultrasonic powder consolidation of Sn/In nanosolder particles and their application to low temperature Cu-Cu joining, JMADE, 111 (2016) 631-639.
[40] Y.W. Wang, Y.W. Lin, C.R. Kao, Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates, Microelectronics Reliability, 49 (2009) 248-252.
[41] T. Laurila, V. Vuorinen, J.K. Kivilahti, Interfacial reactions between lead-free solders and common base materials, Materials Science and Engineering R: Reports, 49 (2005) 1-60.
[42] M.C. Chen, H.C. Hsieh, W. Wu, The evolution of microstructures and mechanical properties during accumulative roll bonding of Al/Mg composite, Journal of Alloys and Compounds, 416 (2006) 169-172.
Iranian Journal of Materials Forming
Volume 8, Issue 1 - Serial Number 1
January 2021
Pages 26-38

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