Workability study in near-pritectic Sn-5%Sb lead-free solder alloy processed by severe plastic deformation

Document Type: Research Paper


1 Materials Processing Simulation Laboratory (MPS – Lab), School of materials and metallurgical engineering, Iran University of science and technology (IUST), Narmak, Tehran, Iran.

2 Materials Processing Simulation Laboratory (MPS – Lab), School of materials and metallurgical engineering, Iran University of science and technology (IUST), Narmak, Tehran, Iran.


Prediction of the deformation characteristics is an important step to understand the workability of alloys during imposing large strains. In this research, severe plastic deformation of Sn-5Sb solder alloy was carried out under different t deformation conditions, including the temperature range of 298, 330, 36, 400 K and die designs. The current study applies an experimentally validated finite element method (FEM) to establish a model for predicting workability in equal channel angular pressing (ECAP). To do this object, two ECAP dies were prepared with channel angle of 90 and the outer corner angle of 30O with and without choked angle in outlet channel. Angularly pressed Sn-5Sb solder alloy were utilized for validating the proposed FEM model. Different parameters such as die angles (angle between the channels and the outer corner angle), pressing temperature and the die outlet channel geometry were studied using FEM simulation. In conclusion, experimentally verified numerical data were successfully used for proficient die design and process determination in the ECAP of tin alloy. The obtained results of hybrid FEM model were in acceptable conformity with experimental measurements.


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