1Materials Processing Simulation Laboratory (MPS &ndash; Lab), School of materials and metallurgical engineering, Iran University of science and technology (IUST), Narmak, Tehran, Iran.
2Materials Processing Simulation Laboratory (MPS – Lab), School of materials and metallurgical engineering, Iran University of science and technology (IUST), Narmak, Tehran, Iran.
Prediction of the deformation characteristics is an important step to understand the workability of alloys during imposing large strains. In this research, severe plastic deformation of Sn-5Sb solder alloy was carried out under different t deformation conditions, including the temperature range of 298, 330, 36, 400 K and die designs. The current study applies an experimentally validated finite element method (FEM) to establish a model for predicting workability in equal channel angular pressing (ECAP). To do this object, two ECAP dies were prepared with channel angle of 90 and the outer corner angle of 30O with and without choked angle in outlet channel. Angularly pressed Sn-5Sb solder alloy were utilized for validating the proposed FEM model. Different parameters such as die angles (angle between the channels and the outer corner angle), pressing temperature and the die outlet channel geometry were studied using FEM simulation. In conclusion, experimentally verified numerical data were successfully used for proficient die design and process determination in the ECAP of tin alloy. The obtained results of hybrid FEM model were in acceptable conformity with experimental measurements.
 R.Z. Valiev and T.G. Langdon, Principles of equal-channel angular pressing as a processing tool for grain refinement, Progress in Materials Science, 51 (2006) 881-981.
 M. Furukawa, Z. Horita and T.G. Langdon, Factors influencing the shearing patterns in equal-channel angular pressing, Materials Science and Engineering: A, 332 (2002) 97-109.
 T.T. Dele-Afolabi, M.A. Azmah Hanim, M. Norkhairunnisa, H.M. Yusoff and M.T. Suraya, Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes, Journal of Alloys and Compounds, 649 (2015) 368-374.
 B.V. Patil, U. Chakkingal and T.S. Prasanna Kumar, Effect of geometric parameters on strain, strain inhomogeneity and peak pressure in equal channel angular pressing – A study based on 3D finite element analysis, Journal of Manufacturing Processes, 17 (2015) 88-97.
 T.G. Langdon, M. Furukawa, M. Nemoto and Z. Horita, Using equal-channel angular pressing for refining grain size, Jom, 52 (2000) 30-33.
 M. Furukawa, Z. Horita, M. Nemoto and T. Langdon, Review: Processing of metals by equal-channel angular pressing, Journal of materials science, 36 (2001) 2835-2843.
 K. Nakashima, Z. Horita, M. Nemoto and T.G. Langdon, Influence of channel angle on the development of ultrafine grains in equal-channel angular pressing, Acta Materialia, 46 (1998) 1589-1599.
 C.G. Yao, B. Wang, D.Q. Yi and X.F. Ding, Artificial neural network modelling to predict hot deformation behaviour of as HIPed FGH4169 superalloy, Materials Science and Technology, 30 (2014) 1170-1176.
 S.C. Yoon, H.-G. Jeong, S. Lee and H.S. Kim, Analysis of plastic deformation behavior during back pressure equal channel angular pressing by the finite element method, Computational Materials Science, 77 (2013) 202-207.
 S. Dumoulin, H.J. Roven, J.C. Werenskiold and H.S. Valberg, Finite element modeling of equal channel angular pressing: Effect of material properties, friction and die geometry, Materials Science and Engineering: A, 410–411 (2005) 248-251.
 M. Shaeri, M. Salehi, S. Seyyedein, M. Abutalebi and J. Park, Characterization of microstructure and deformation texture during equal channel Angular pressing of Al–Zn–Mg–Cu alloy, Journal of Alloys and Compounds, 576 (2013) 350-357.
 N.E. Mahallawy, F.A. Shehata, M.A.E. Hameed, M.I.A.E. Aal and H.S. Kim, 3D FEM simulations for the homogeneity of plastic deformation in Al–Cu alloys during ECAP, Materials Science and Engineering: A, 527 (2010) 1404-1410.
 F. Djavanroodi and M. Ebrahimi, Effect of die channel angle, friction and back pressure in the equal channel angular pressing using 3D finite element simulation, Materials Science and Engineering: A, 527 (2010) 1230-1235.
 E. Cerri, P.P. De Marco and P. Leo, FEM and metallurgical analysis of modified 6082 aluminium alloys processed by multipass ECAP: Influence of material properties and different process settings on induced plastic strain, Journal of Materials Processing Technology, 209 (2009) 1550-1564.
 F. Djavanroodi, H. Ahmadian, K. Koohkan and R. Naseri, Ultrasonic assisted-ECAP, Ultrasonics, 53 (2013) 1089-1096.
 S.C. Baik, Y. Estrin, R.J. Hellmig, H.-T. Jeong, H.G. Brokmeier and H.S. Kim, Modeling of texture evolution in copper under equal channel angular pressing, Zeitschrift für Metallkunde, 94 (2003) 1189-1198.
 G.Y. Deng, C. Lu, L.H. Su, X.H. Liu and A.K. Tieu, Modeling texture evolution during ECAP of copper single crystal by crystal plasticity FEM, Materials Science and Engineering: A, 534 (2012) 68-74.
 R.B. Figueiredo, I.P. Pinheiro, M.T.P. Aguilar, P.J. Modenesi and P.R. Cetlin, The finite element analysis of equal channel angular pressing (ECAP) considering the strain path dependence of the work hardening of metals, Journal of Materials Processing Technology, 180 (2006) 30-36.
 E. Karaköse, M.F. Kılıçaslan and H. Çolak, Formation of novel rice-like intermetallic phases and changes in the mechanical, microstructural and electrical properties of Sn–5Sb alloys with addition Ag and Bi, Journal of Alloys and Compounds, 655 (2016) 378-388.
 R. Mahmudi, A.R. Geranmayeh, M. Bakherad and M. Allami, Indentation creep study of lead-free Sn–5%Sb solder alloy, Materials Science and Engineering: A, 457 (2007) 173-179.
 F.J. Humphreys and M. Hatherly, Recrystallization and Related Annealing Phenomena, Elsevier Science, (2012).
 F. Djavanroodi, B. Omranpour and M. Sedighi, Artificial neural network modeling of ECAP process, Materials and Manufacturing Processes, 28 (2013) 276-281.
 F. Yang and M.J.C. Li, Deformation behavior of tin and some tin alloys, Journal of Materials Science: Materials in Electronics, 18 (2006) 191-210.